High level FR4 PCBA Case Service Providing Full-Scale Solutions for Complex Circuit Boards

General PCBA Information:

Base material:FR4 epoxy resin

Board thickness:1.6mm

Surface finish:Immersion gold

Board size:7.2*17.3CM

Copper thickness:1OZ

Solder mask and silkscreen: green and white

Components sourcing:yes

Our PCBA Capability

SMT, PTH, mixed technology

SMT: 2,000,000 solder joints per day

DIP: 300,000 joints per day

Ultra fine pitch, QFP, BGA, μBGA, CBGA

Advanced SMT assembly

Automated insertion of PTH (axial, radial, dip)

Cleanable, aqueous and lead-free processing

RF manufacturing expertise

Peripheral process capabilities

Press fit back planes & mid planes

Device programming

Automated conformal coating

For E-Test

Universal Tester

Flying Probe Open/Short Tester

High power Microscope

Solder ability Testing Kit

Peel Strength tester

High Volt Open & Short tester

Cross Section Molding Kit With Polisher

Technical requirement for pcb assembly:

1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603,0402,0201 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.

Quote requirement for pcb and pcb assembly:

1)Gerber file and Bom list Gerber file,PCB file,Eagle file or CAD file all acceptable
2)Clear pics of pcba or pcba sample for us This will help a lot for the fast purchasing as request
3)Test method for PCBA This can guarantee 100% good quality products when delivered

Assembly Capabilities

· Printed Circuit Board Assembly (PCBA)

· Through Hole

· Surface Mount (SMT)

· PCB Handling up to 400mm x 500mm

· RoHS Compliance Production

· Non RoHS Production – where permitted

· AOI

Component Technologies

· Passive Down to 0201 size

· BGA and VFBGA

· Leadless Chip Carriers/CSP

· Fine Pitch to 0.8mils

· BGA Repair and Reball

· Part Removal and Replacement

Production Details:

1) Material Management

Supplier → Components Purchase → IQC → Protection Control → Material Supply → Firmware

2) Program Management

PCB Files → DCC → Program Organizing → Optimization → Checking

3) SMT Management

PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping

4) PCBA Management

THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment

The PCB assembly process typically includes the following steps:

Component Procurement: The required electronic components are sourced from suppliers. This involves selecting components based on specifications, availability, and cost.

PCB Fabrication: The bare PCBs are manufactured using specialized techniques such as etching or printing. The PCBs are designed with copper traces and pads to establish electrical connections between the components.

Component Placement: Automated machines, called pick-and-place machines, are used to accurately place surface mount components (SMD components) on the PCB. These machines can handle a large number of components with precision and speed.

Soldering: Once the components are placed on the PCB, soldering is performed to establish electrical and mechanical connections. There are two common methods used for soldering: a. Reflow Soldering: This method involves applying solder paste to the PCB, which contains small solder balls. The PCB is then heated in a reflow oven, causing the solder to melt and create connections between the components and the PCB. b. Wave Soldering: This method is typically used for through-hole components. The PCB is passed over a wave of molten solder, which creates solder connections on the bottom side of the board.

Inspection and Testing: After soldering, the assembled PCBs undergo inspection to check for defects, such as solder bridges or missing components. Automated optical inspection (AOI) machines or human inspectors perform this step. Functional testing may also be conducted to ensure the PCB operates as intended.

Final Assembly: Once the PCBs pass inspection and testing, they can be integrated into the final product. This may involve additional assembly steps, such as attaching connectors, cables, enclosures, or other mechanical components.

Certainly! Here are some additional details about PCB assembly:

Surface Mount Technology (SMT): Surface mount components, also known as SMD (Surface Mount Device) components, are widely used in modern PCB assembly. These components have small footprints and are mounted directly onto the surface of the PCB. This allows for higher component density and smaller PCB sizes. SMT components are typically placed using automated pick-and-place machines, which can handle components of various sizes and shapes.

Through-Hole Technology (THT): Through-hole components have leads that pass through holes in the PCB and are soldered on the opposite side. While SMT components dominate modern PCB assembly, through-hole components are still used for certain applications, especially when components require extra mechanical strength or high power handling capabilities. Wave soldering is commonly used for soldering through-hole components.

Mixed Technology Assembly: Many PCBs incorporate a combination of surface mount and through-hole components, referred to as mixed technology assembly. This allows for a balance between component density and mechanical strength, as well as accommodating components that are not available in surface mount packages.

Prototype vs. Mass Production: PCB assembly can be performed for both prototype and mass production runs. In prototype assembly, the focus is on building a small number of boards for testing and validation purposes. This may involve manual component placement and soldering techniques. Mass production, on the other hand, requires high-speed automated assembly processes to achieve efficient and cost-effective production of large quantities of PCBs.

Design for Manufacturing (DFM): DFM principles are applied during the PCB design phase to optimize the assembly process. Design considerations such as component placement, orientation, and proper clearances help ensure efficient assembly, reduce manufacturing defects, and minimize production costs.

Quality Control: Quality control is an integral part of PCB assembly. Various inspection techniques are employed, including visual inspection, automated optical inspection (AOI), and X-ray inspection, to detect defects such as solder bridges, missing components, or incorrect orientations. Functional testing may also be conducted to verify the proper operation of the assembled PCB.

RoHS Compliance: Restriction of Hazardous Substances (RoHS) directives restrict the use of certain hazardous materials, such as lead, in electronic products. PCB assembly processes have adapted to comply with RoHS regulations, using lead-free soldering techniques and components.

Outsourcing: PCB assembly can be outsourced to specialized contract manufacturers (CMs) or electronic manufacturing service (EMS) providers. Outsourcing allows companies to leverage the expertise and infrastructure of dedicated assembly facilities, which can help reduce costs, increase production capacity, and access specialized equipment or expertise.